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SOD-323HE Diode for Automotive 、Home Appliances, Etc
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Introduction 1、With ultra-thin package shape, it can be used in miniaturized and thin circuits；
2、The bottom side of the package has a heat sink, which has excellent heat dissipation performance；
3、There are many kinds of packaging chips, including GPP, Schottky;
4、Products are widely used in secondary rectifier circuits, converters, freewheeling diodes, AC/DC power protection , etc.
Features 1、Excellent heat dissipation performance: the back pad has large area, good heat dissipation performance and strong flow capacity, which can meet the requirements of high-temperature applications
2、Thin package shape ：the package shape is thinner than SOD-123FL package and meets the development trend of packaging thinness
SPECIFICATION

FMG1AE THRU FMG1JE

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